Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC μModule in LGA Package

DFM Rules for Smartphones: An Analysis of Yield on Extremely Dense Assemblies

Handheld portable products such as smartphones are trending toward smaller form factors while simultaneously increasing in functionality to keep up with consumer demands. This is achieved in part by decreasing the size of components and increasing the density of the circuitry. These unique product needs drive different Design for Manufacturing (DFM) recommendations than those that are in use fo...

Implementation of Floating Output Interleaved Input DC-DC Boost Converter

This paper presents the analysin ,design and implementation of a high voltage ratio topology of DC-DC converter. The DC-DC converter has high voltage ratio with reduced input current, output voltage and output current ripple, and also reduces the voltage and current rating of power electronics components and compared with conventional boost converter. The voltage stress on the switches are  red...

Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

Reliability of CGA/LGA/HDI Package Board/Assembly

Digital Controller Designbased on Time Domain for DC-DC Buck Converter

In this paper, the digital controller design for compensating the dc-dc buck converter output voltage has been analyzed in the digital domain. The main idea of this paper is patterning the samples of high order ideal controller and using integral square error in determining digital PID coefficients. This approach provides higher precision of digital controller design and eliminates the need for...